The MIST Process involves applying the C3 carrier fluid containing the pre-selected materials onto the substrate by spraying, wiping, or dipping, and then baking at a low temperature. A thin film of no more than 100 nanometers (0.1 Micron), is thus “anchored” or “rooted” at the molecular level into the treated substrate.
C3 provides fast turn-around of its various treatments, even for large volume or heavy industrial tools, via its simple production process:
